Failure Analysis
Failure Analysis

Items

Standard

Purpose

Precondition (PRE)

JESD22-A113F

To simulate the effects of changing circumstances including elevated temperatures and moisture during transportation, storage until board assembly. The test should be conducted prior to reliability testing.

Moisture Sensitivity Level (MSL)

IPC/JEDEC J-STD-020

To identify the classification level of non-hermetic surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

Temperature & Humidity Test (THT)

GB/T2423.3

JESD22-A101

To evaluate the ability of product to withstand stress of humidity and temperature for a long time.

Temperature Cycling Test (TCT)

JESD22-A104

GB/T 2423.22

To evaluate the ability of product to withstand alternating high- and low-temperature extremes.

High Temperature Storage Test (HTST)

GB/T 2423.2

JESD22-A103

To evaluate the ability of product to withstand stress of high temperature for a long time.

Low Temperature Storage Test (LTST)

GB/T 2423.1

JESD22-A119

To evaluate the ability of product to withstand stress of low temperature for a long time.

Pressure Cooker Test

(PCT)

JESD22-A102

To evaluate the moisture resistance of package.

Highly Accelerated

Stress Test (u)HAST

JESD22-A110

JESD22-A118

To evaluate the moisture resistance of non-hermetic packaged  devices under/without bias.

Reflow

JESD22-A113

To assess thermal resistance and effect produced in reflow soldering process.

BURN-IN

GB/T 4587

To access device’s ability of bearing electric stress (voltage and current) and temperature stress (products temperature rise due to loading) for a long time.

High Temperature Reverse Bias  (HTRB)

GB/T 4587

JESD22-A108

To determine the effects of bias conditions and temperature on solid state devices over time.

Soldering Heat Test

(SHT)

GB/T 2423.28

JESD22-B106

To determine whether solid state devices can withstand the effect of the temperature shock during soldering.

Solderability

GB/T 2423.28

EIA/IPC/JEDEC J-STD-002

To evaluate the solderability of product.

Tin Whisker Test

JESD201

JESD22-A121

To assess the tin whisker growth situation of products under temperature and humidity stress for long time.

Electrical Test

GB/T 4589.1

GB/T 4587

GB/T 4586

GB/T 4023

GB/T 6571

To evaluate the product electrical capacity. Mainly aimed at discrete device.

Test items above have been accredited by CNAS.


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